科研方向

针对高熵合金、钛合金、铝合金等新型金属材料及异种材料体系，系统研究焊接过程中的冶金行为、界面反应机制与元素扩散规律，揭示接头组织演变对力学性能的影响规律。For novel metals and dissimilar material systems such as high-entropy alloys, titanium alloys, and aluminum alloys, we systematically study the metallurgical behavior, interfacial reaction mechanisms, and elemental diffusion during welding, revealing how microstructural evolution in the joint governs mechanical performance.

结合原位电镜表征手段，实时观测焊接界面的形成过程，为异种材料连接工艺的优化提供理论支撑，实现高性能接头的可控制备。Combined with in-situ TEM characterization, we observe the formation of the welding interface in real time, providing theoretical support for process optimization and the controllable fabrication of high-performance joints.

针对工程领域中广泛应用的焊接结构，系统开展疲劳、断裂及腐蚀行为研究，分析焊接残余应力与焊接缺陷对结构完整性的影响，建立适用于工程实际的寿命预测模型。For welded structures widely used in engineering, we systematically study fatigue, fracture, and corrosion behavior, analyze how welding residual stress and defects affect structural integrity, and build life-prediction models suited to practical engineering.

结合有限元模拟与试验验证，为海洋、航空、核能等领域关键焊接结构的延寿评估提供科学依据，保障重大工程装备的长期安全运役。Combining finite-element simulation with experimental validation, we provide a scientific basis for the life-extension assessment of critical welded structures in marine, aerospace, and nuclear applications, safeguarding the long-term safe operation of major engineering equipment.

基于电弧熔丝增材制造（Wire Arc Additive Manufacturing, WAAM）技术，系统研究钛合金、铝合金、高强钢等材料的增材成形工艺参数、热-力耦合行为与微观组织演变规律。Using Wire Arc Additive Manufacturing (WAAM), we systematically study the forming process parameters, thermo-mechanical coupling behavior, and microstructural evolution of titanium alloys, aluminum alloys, high-strength steels, and other materials.

通过工艺优化与后处理技术相结合，调控增材构件的微观组织，实现大型复杂金属结构件的高效、低成本、高性能制造，为航空航天、船舶海工等领域提供技术支撑。By combining process optimization with post-processing, we tailor the microstructure of additively manufactured components to achieve efficient, low-cost, high-performance production of large, complex metal parts, supporting aerospace and marine engineering applications.

发展原位透射电子显微镜技术，在原子尺度实时观测焊接界面的形成、相变及变形断裂过程，揭示连接过程中的微观动态机制。We develop in-situ transmission electron microscopy techniques to observe, in real time and at the atomic scale, the formation, phase transformation, and deformation–fracture of welding interfaces, revealing the microscale dynamic mechanisms of joining.

通过原位加热、原位拉伸及原位电子束辐照等实验手段，直接捕捉界面扩散、析出相形核及裂纹萌生扩展的动态过程，为连接工艺优化提供原子尺度依据。Through in-situ heating, straining, and electron-beam irradiation, we directly capture the dynamic processes of interfacial diffusion, precipitate nucleation, and crack initiation and propagation, providing atomic-scale insight for process optimization.

利用纳米压痕、微柱压缩、原位拉伸等微纳米力学测试手段，定量表征焊接接头热影响区、界面区等局部区域的力学性质。Using micro/nano-mechanical testing such as nanoindentation, micropillar compression, and in-situ tensile testing, we quantitatively characterize the local mechanical properties of welded joints, including the heat-affected and interfacial zones.

建立局部力学性质与宏观性能之间的多尺度关联，为焊接接头本构模型的建立及结构完整性评价提供精确的微区力学数据支撑。We establish multiscale correlations between local mechanical properties and macroscopic performance, providing accurate micro-region data to support constitutive modeling and structural-integrity assessment of welded joints.

研究先进芯片封装中焊点、铜柱等互连结构的材料与工艺，解决高密度封装中热-力耦合引起的可靠性失效问题。We study the materials and processes of interconnect structures such as solder joints and copper pillars in advanced chip packaging, addressing reliability failures caused by thermo-mechanical coupling in high-density packaging.

结合原位电镜与微纳力学表征手段，揭示封装互连材料在热循环服役条件下的微观损伤演变机制，为下一代先进封装的可靠性设计提供理论基础。Combining in-situ TEM and micro/nano-mechanical characterization, we reveal the microscale damage evolution of interconnect materials under thermal-cycling service conditions, providing a theoretical basis for the reliability design of next-generation advanced packaging.