焊接与先进制造技术研究所

探索连接的微观机制
驱动先进制造的未来Exploring the Microscale Mechanisms
of Joining & Advanced Manufacturing

我们致力于新材料及异种材料连接、焊接结构评价与延寿、电弧增材制造等前沿领域，结合原位电镜表征与微纳力学，推动焊接学科在航空航天、核工业、电子封装领域的应用与发展。We focus on novel material joining, structural integrity of welded components, wire arc additive manufacturing, in-situ TEM characterization, and nanomechanics — advancing the application and development of welding in aerospace, nuclear industry, and electronic packaging.

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百卅荣光 强国担当 — 天津大学

主要研究方向

围绕先进制造国家战略需求，开展基础与应用研究

01

新材料及异种材料连接Novel Material Joining

针对高熵合金、钛合金、铝合金等新材料及异种材料体系，研究焊接冶金行为与接头性能调控机制。Investigating welding metallurgy and joint performance of high-entropy alloys, titanium, aluminum alloys, and dissimilar material systems.

02

焊接结构评价与延寿Structural Integrity & Life Extension

开展焊接结构的疲劳、断裂及腐蚀行为研究，建立寿命预测模型，为工程结构延寿提供理论依据。Studying fatigue, fracture, and corrosion of welded structures, and developing life prediction models for engineering applications.

03

电弧增材制造Wire Arc Additive Manufacturing

基于电弧熔丝增材制造（WAAM）技术，研究大型金属构件的成形工艺、组织调控与力学性能优化。Employing WAAM to investigate forming processes, microstructure control, and mechanical property optimization of large metal components.

04

原位电镜表征In-Situ TEM Characterization

发展原位透射电子显微镜技术，实时观测连接界面的形成演变过程，揭示微观变形与断裂机制。Developing in-situ TEM techniques to observe real-time evolution of joining interfaces and reveal microscale deformation and fracture mechanisms.

05

微纳力学Micro/Nanomechanics

利用微纳米力学测试手段，定量表征焊接接头局部区域的力学性质，为本构模型建立提供数据支撑。Quantitatively characterizing local mechanical properties of welded joints via micro/nano-mechanical testing to support constitutive model development.

06

半导体集成封装Semiconductor Packaging

研究先进芯片封装中的互连材料与工艺，解决高密度封装面临的热-力耦合可靠性问题。Investigating interconnect materials and processes in advanced chip packaging to address thermo-mechanical reliability challenges.

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最新动态

课题组近期研究进展与重要事件

2026届毕业合影
2026年5月May 2026 人员People
热烈祝贺杨旭、木瑞洁博士毕业，兰中霖、王涛、温奇、雍臻、于泽、张冬雪硕士毕业！Congratulations to our 2026 graduates — Ph.D. graduates Xu Yang and Ruijie Mu, and M.S. graduates Zhonglin Lan, Tao Wang, Qi Wen, Zhen Yong, Ze Yu, and Dongxue Zhang!
岁月不居，时节如流。杨旭、木瑞洁顺利完成博士学业，兰中霖、王涛、温奇、雍臻、于泽、张冬雪圆满完成硕士阶段学习，恭喜毕业，前途似锦！Xu Yang and Ruijie Mu have successfully completed their doctoral studies, and Zhonglin Lan, Tao Wang, Qi Wen, Zhen Yong, Ze Yu, and Dongxue Zhang have completed their master's studies. Congratulations to all — we wish you a bright future ahead!
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2025年4月Apr 2025 人员People
欢迎韩英教授加入天津大学，担任英才教授Prof. Ying Han joins Tianjin University as Distinguished Professor
韩英教授结束在美国加州大学尔湾分校的博士后研究，正式加入天津大学材料科学与工程学院，担任英才教授，专注于原位电镜表征与微纳力学研究。After completing her postdoctoral research at the University of California, Irvine, Prof. Ying Han has joined the School of Materials Science & Engineering at Tianjin University as a Distinguished Professor, focusing on in-situ TEM characterization and nanomechanics.
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2025年2025 项目Grant
王颖教授获国家自然科学基金联合重点项目资助Prof. Ying Wang awarded an NSFC Joint Key Program grant
王颖教授主持的国家自然科学基金联合重点项目正式获批，项目执行期2025—2028年，聚焦新材料及异种材料连接科学问题研究。A Joint Key Program of the National Natural Science Foundation of China (NSFC) led by Prof. Ying Wang has been approved. Running from 2025 to 2028, the project addresses fundamental scientific questions in novel and dissimilar material joining.
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代表性论文

近年发表于高影响力期刊的重要成果

Excellent high-temperature strength of (HfZrTiTaNb)C high-entropy carbide diffusion-bonded joint via in-situ alloying of Ni/Nb/Ni composite interlayer
Ruijie Mu, Ying Wang*, Shiyu Niu, Kongbo Sun, Zhenwen Yang*
Journal of Advanced Ceramics
2025 SCI Q1 IF 16.6
Grain rotation mechanisms in nanocrystalline materials: Multiscale observations in Pt thin films
Y Tian, X Gong, M Xu, C Qiu, Ying Han, Y Bi, LV Estrada, E Boltynjuk, et al.
Science
2024 SCI Q1 IF 44.0
Three-dimensional integration of two-dimensional field-effect transistors
D Jayachandran, R Pendurthi, MUK Sadaf, NU Sakib, A Pannone, Ying Han, et al.
Nature
2024 SCI Q1 IF 50.0
Elastic straining of free-standing monolayer graphene
K Cao, S Feng, Ying Han, L Gao, T Hue Ly, Z Xu, Y Lu
Nature Communications
2020 SCI Q1 IF 14.7 被引 500+ · ESI高被引500+ Citations · ESI Highly Cited
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课题组团队

来自不同背景的优秀研究人员共同推进科学前沿

王颖
王颖Ying Wang
教授 / 课题组长
新材料连接
博士生导师Novel Material Joining
Ph.D. Supervisor
杨振文
杨振文Zhenwen Yang
教授
异种材料连接 · 增材制造Dissimilar Joining · Additive Manufacturing
韩英
韩英Ying Han
英才教授
原位电镜 · 微纳力学In-situ TEM · Nanomechanics
牛士玉
牛士玉Shiyu Niu
副研究员
新材料连接与界面表征Material Joining & Interface Characterization
博
博士生Ph.D. Students
博士研究生
电弧增材制造Wire Arc Additive Manufacturing
硕
硕士生M.S. Students
硕士研究生
微纳力学表征Micro/Nanomechanics
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